Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
1.7 V
Maximum Operating Supply Voltage
1.95 V
Block Organisation
Symmetrical
Length
6.1mm
Height
0.85mm
Width
8.1mm
Dimensions
8.1 x 6.1 x 0.85mm
Series
W25N
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
8ns
Stock information temporarily unavailable.
Please check again later.
SR 17.04
Each (In a Pack of 5) (ex VAT)
SR 19.596
Each (In a Pack of 5) (inc VAT)
5
SR 17.04
Each (In a Pack of 5) (ex VAT)
SR 19.596
Each (In a Pack of 5) (inc VAT)
5
Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
1.7 V
Maximum Operating Supply Voltage
1.95 V
Block Organisation
Symmetrical
Length
6.1mm
Height
0.85mm
Width
8.1mm
Dimensions
8.1 x 6.1 x 0.85mm
Series
W25N
Number of Words
128M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
8ns