Technical Document
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Parallel
Package Type
VFBGA
Pin Count
63
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
11.1mm
Height
0.6mm
Width
9.1mm
Dimensions
11.1 x 9.1 x 0.6mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
25µs
Series
W29N
Number of Words
256M
Minimum Operating Temperature
-40 °C
Country of Origin
Taiwan, Province Of China
P.O.A.
Each (Supplied in a Tray) (ex VAT)
Production pack (Tray)
2
P.O.A.
Each (Supplied in a Tray) (ex VAT)
Production pack (Tray)
2
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Technical Document
Specifications
Brand
WinbondMemory Size
2Gbit
Interface Type
Parallel
Package Type
VFBGA
Pin Count
63
Organisation
256M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
11.1mm
Height
0.6mm
Width
9.1mm
Dimensions
11.1 x 9.1 x 0.6mm
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
25µs
Series
W29N
Number of Words
256M
Minimum Operating Temperature
-40 °C
Country of Origin
Taiwan, Province Of China