Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
13.2 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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SR 3,900.00
SR 1.95 Each (On a Reel of 2000) (ex VAT)
SR 4,485.00
SR 2.242 Each (On a Reel of 2000) (inc. VAT)
2000
SR 3,900.00
SR 1.95 Each (On a Reel of 2000) (ex VAT)
SR 4,485.00
SR 2.242 Each (On a Reel of 2000) (inc. VAT)
2000
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3528-21
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.5mm
Depth
2.8mm
Maximum Operating Temperature
+105°C
Height
1.9mm
Dimensions
3.5 x 2.8 x 1.9mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
13.2 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets