Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
SR 28.86
SR 28.86 Each (ex VAT)
SR 33.19
SR 33.19 Each (inc. VAT)
Standard
1
SR 28.86
SR 28.86 Each (ex VAT)
SR 33.19
SR 33.19 Each (inc. VAT)
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
Standard
1
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


