Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
China
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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SR 1,401.60
SR 23.36 Each (In a Tube of 60) (ex VAT)
SR 1,611.84
SR 26.864 Each (In a Tube of 60) (inc. VAT)
60
SR 1,401.60
SR 23.36 Each (In a Tube of 60) (ex VAT)
SR 1,611.84
SR 26.864 Each (In a Tube of 60) (inc. VAT)
60
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
3
Type
Board to Board
Mounting Type
Through Hole
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.15A
Voltage Rating
250 V
Series
Z-PACK HM
Contact Material
Copper
Country of Origin
China
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.