Technical Document
Specifications
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size (mm²)
0.2mm²
Maximum Wire Size mm²
0.6mm²
Termination Method
Crimp
Maximum Wire Size (mm²)
0.6mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Minimum Wire Size (AWG)
24AWG
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Wire Size (AWG)
20AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
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P.O.A.
Production pack (Reel)
100
P.O.A.
Production pack (Reel)
100
Technical Document
Specifications
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.2mm²
Minimum Wire Size (mm²)
0.2mm²
Maximum Wire Size mm²
0.6mm²
Termination Method
Crimp
Maximum Wire Size (mm²)
0.6mm²
Minimum Wire Size AWG
24AWG
Contact Plating
Gold
Minimum Wire Size (AWG)
24AWG
Maximum Wire Size AWG
20AWG
Contact Material
Phosphor Bronze
Maximum Wire Size (AWG)
20AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Product details
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
For suitable Crimp Tool for 668-9713, 668-9716, 668-9719, 668-9722 and 778-0974 see stock number 233-0044
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.