Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
100V dc
Package/Case
1210 (3225M)
Mounting Type
Surface Mount
Dielectric
C0G, NP0
Tolerance
±5%
Dimensions
3.2 x 2.5 x 2mm
Length
3.2mm
Depth
2.5mm
Height
2mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1210
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
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SR 1.54
Each (In a Pack of 5) (ex VAT)
SR 1.771
Each (In a Pack of 5) (inc. VAT)
Standard
5
SR 1.54
Each (In a Pack of 5) (ex VAT)
SR 1.771
Each (In a Pack of 5) (inc. VAT)
Standard
5
Technical Document
Specifications
Brand
Syfer TechnologyCapacitance
1nF
Voltage
100V dc
Package/Case
1210 (3225M)
Mounting Type
Surface Mount
Dielectric
C0G, NP0
Tolerance
±5%
Dimensions
3.2 x 2.5 x 2mm
Length
3.2mm
Depth
2.5mm
Height
2mm
Series
Flexicap
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
Syfer Flexicap 1210
FlexiCap™ has been developed as a result of listening to customers experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes