Technical Document
Specifications
Brand
onsemiPackage Type
MLP 3.3 x 3.3
Mounting Type
Surface Mount
Maximum Power Dissipation
40 W
Pin Count
8
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Dimensions
3.3 x 3.3 x 0.72mm
Country of Origin
Thailand
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Production pack (Reel)
10
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Production pack (Reel)
10
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Technical Document
Specifications
Brand
onsemiPackage Type
MLP 3.3 x 3.3
Mounting Type
Surface Mount
Maximum Power Dissipation
40 W
Pin Count
8
Number of Elements per Chip
1
Maximum Operating Temperature
+150 °C
Dimensions
3.3 x 3.3 x 0.72mm
Country of Origin
Thailand