Technical Document
Specifications
Brand
MolexSeries
SlimStack
Product Type
PCB Header
Pitch
0.5mm
Current
500mA
Number of Contacts
80
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Plating
Gold
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
0.5mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
50 V
Distrelec Product Id
304-57-446
Country of Origin
Japan
Product details
SlimStack™ Micro SMT Stacking Connectors
SlimStack™ Plugs and Receptacles available in stacking heights of:
1.5mm SlimStack™ Receptacles Series 54722 and Plugs Series 55560
3.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53748
4.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53916
Gold plated contacts for high reliability connectivity
High density capability
Secure retention against shock and vibration
Stock information temporarily unavailable.
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Production pack (Reel)
5
P.O.A.
Each (Supplied on a Reel) (ex VAT)
Stock information temporarily unavailable.
Production pack (Reel)
5
Technical Document
Specifications
Brand
MolexSeries
SlimStack
Product Type
PCB Header
Pitch
0.5mm
Current
500mA
Number of Contacts
80
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Plating
Gold
Contact Material
Brass
Minimum Operating Temperature
-40°C
Row Pitch
0.5mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
50 V
Distrelec Product Id
304-57-446
Country of Origin
Japan
Product details
SlimStack™ Micro SMT Stacking Connectors
SlimStack™ Plugs and Receptacles available in stacking heights of:
1.5mm SlimStack™ Receptacles Series 54722 and Plugs Series 55560
3.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53748
4.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53916
Gold plated contacts for high reliability connectivity
High density capability
Secure retention against shock and vibration


