Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

RS Stock No.: 670-2119PBrand: MolexManufacturers Part No.: 43650-0209
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Technical Document

Specifications

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Number of Contacts

2

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

Country of Origin

Mexico

Product details

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features & Benefits

High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Through hole versions SMT compatible
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solderable retention clips for PCB retention
Glow Wire Compliant
Kinked solder legs for additional PCB retention

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications. Applications include Military COTS (Commercial Off The Shelf), solar power, consumer products, data communications, medical, telecommunications and gaming terminals

Molex Micro-Fit 3.0 Series

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Stock information temporarily unavailable.

P.O.A.

Each (Supplied on a Reel) (ex VAT)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded
Select packaging type

P.O.A.

Each (Supplied on a Reel) (ex VAT)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 2 Contact(s), 3 mm Pitch, 1 Row(s), Shrouded

Stock information temporarily unavailable.

Select packaging type

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Technical Document

Specifications

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Number of Contacts

2

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Minimum Operating Temperature

-40°C

Row Pitch

3mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

Country of Origin

Mexico

Product details

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Press Fit Metal Retention Clip, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board PCB thruogh hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, solderable metal press-fit retention clips are incorporated into the connector design. The through hole versions with part numbers endng in xx18 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features & Benefits

High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Through hole versions SMT compatible
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solderable retention clips for PCB retention
Glow Wire Compliant
Kinked solder legs for additional PCB retention

Product Application Information

These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications. Applications include Military COTS (Commercial Off The Shelf), solar power, consumer products, data communications, medical, telecommunications and gaming terminals

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more