Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
SR 227.74
SR 227.74 1 Bag of 10 (ex VAT)
SR 261.90
SR 261.90 1 Bag of 10 (inc. VAT)
1
SR 227.74
SR 227.74 1 Bag of 10 (ex VAT)
SR 261.90
SR 261.90 1 Bag of 10 (inc. VAT)
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
1
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
