Chemtronics 1.5m No Clean Desoldering Braid, Width 5.3mm

Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
SR 40.45
SR 40.45 Each (ex VAT)
SR 46.52
SR 46.52 Each (inc. VAT)
1
SR 40.45
SR 40.45 Each (ex VAT)
SR 46.52
SR 46.52 Each (inc. VAT)
Stock information temporarily unavailable.
1
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips