Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
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Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

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Stock information temporarily unavailable.

SR 325.10

SR 325.10 Each (ex VAT)

SR 373.86

SR 373.86 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
1SR 325.10
2SR 650.20
3SR 975.30
4SR 1,300.40
5SR 1,625.50
6SR 1,950.60
7SR 2,275.70
8SR 2,600.80
9SR 2,925.90
10SR 3,251.00
11SR 3,576.10
12SR 3,901.20
13SR 4,226.30
14SR 4,551.40
15SR 4,876.50

SR 325.10

SR 325.10 Each (ex VAT)

SR 373.86

SR 373.86 Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
1SR 325.10
2SR 650.20
3SR 975.30
4SR 1,300.40
5SR 1,625.50
6SR 1,950.60
7SR 2,275.70
8SR 2,600.80
9SR 2,925.90
10SR 3,251.00
11SR 3,576.10
12SR 3,901.20
13SR 4,226.30
14SR 4,551.40
15SR 4,876.50

Stock information temporarily unavailable.

Please check again later.

You may be interested in

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in