Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
BGA Heatsinks
SR 62.59
SR 62.59 Each (ex VAT)
SR 71.98
SR 71.98 Each (inc. VAT)
1
SR 62.59
SR 62.59 Each (ex VAT)
SR 71.98
SR 71.98 Each (inc. VAT)
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
1
Stock information temporarily unavailable. please contact rs@ae.com.sa for more details.
Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
