Fischer Elektronik Heatsink, Universal Rectangular Alu, 71K/W, 8 x 8 x 6mm

RS Stock No.: 692-0694Brand: Fischer ElektronikManufacturers Part No.: ICK SMD F 8MI
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Technical Document

Specifications

Brand

Fischer Elektronik

For Use With

Universal Rectangular Alu

Length

8mm

Width

8mm

Height

6mm

Dimensions

8 x 8 x 6mm

Thermal Resistance

71K/W

Colour

Black

Package Type

DIL-IC

Material

Aluminium

Country of Origin

Germany

Product details

ICK SMD Heatsink Series

Heat Sinks for DIL-IC, PLCC and SMD

Particularly suitable for SMD components
Low profile
Reduced weight
Effective heat dissipation
Can be glued directly onto component
Solderable versions available

Stock information temporarily unavailable.

SR 97.55

SR 19.51 Each (In a Pack of 5) (ex VAT)

SR 112.18

SR 22.436 Each (In a Pack of 5) (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu, 71K/W, 8 x 8 x 6mm

5

Available in multiples of 5
5SR 97.55
10SR 195.10
15SR 292.65
20SR 390.20
25SR 487.75
30SR 585.30
35SR 682.85
40SR 780.40
45SR 877.95
50SR 975.50
55SR 1,073.05
60SR 1,170.60
65SR 1,268.15
70SR 1,365.70
75SR 1,463.25

SR 97.55

SR 19.51 Each (In a Pack of 5) (ex VAT)

SR 112.18

SR 22.436 Each (In a Pack of 5) (inc. VAT)

Fischer Elektronik Heatsink, Universal Rectangular Alu, 71K/W, 8 x 8 x 6mm
Stock information temporarily unavailable.

5

Available in multiples of 5
5SR 97.55
10SR 195.10
15SR 292.65
20SR 390.20
25SR 487.75
30SR 585.30
35SR 682.85
40SR 780.40
45SR 877.95
50SR 975.50
55SR 1,073.05
60SR 1,170.60
65SR 1,268.15
70SR 1,365.70
75SR 1,463.25

Stock information temporarily unavailable.

Please check again later.

Technical Document

Specifications

Brand

Fischer Elektronik

For Use With

Universal Rectangular Alu

Length

8mm

Width

8mm

Height

6mm

Dimensions

8 x 8 x 6mm

Thermal Resistance

71K/W

Colour

Black

Package Type

DIL-IC

Material

Aluminium

Country of Origin

Germany

Product details

ICK SMD Heatsink Series

Heat Sinks for DIL-IC, PLCC and SMD

Particularly suitable for SMD components
Low profile
Reduced weight
Effective heat dissipation
Can be glued directly onto component
Solderable versions available