Vishay 10μF Surface Mount Polymer Capacitor, 4V dc
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
1608-09
Equivalent Series Resistance
500mΩ
Tolerance
±20%
Length
1.6mm
Depth
0.8mm
Maximum Operating Temperature
+105°C
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
10 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
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SR 1.15
Each (On a Reel of 4000) (ex VAT)
SR 1.322
Each (On a Reel of 4000) (inc. VAT)
4000
SR 1.15
Each (On a Reel of 4000) (ex VAT)
SR 1.322
Each (On a Reel of 4000) (inc. VAT)
4000
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
4V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
1608-09
Equivalent Series Resistance
500mΩ
Tolerance
±20%
Length
1.6mm
Depth
0.8mm
Maximum Operating Temperature
+105°C
Height
0.8mm
Dimensions
1.6 x 0.8 x 0.8mm
Series
T55
Electrolyte Type
Solid
Minimum Operating Temperature
-55°C
Leakage Current
10 μA
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products