Technical Document
Specifications
Brand
Vero TechnologiesBase Material
Synthetic Resin Bonded Paper
Number of Sides
1
Dimensions
100 x 160 x 1.6mm
Hole Diameter
1.02mm
Hole Layout
53 x 5
Hole Pitch
2.54 x 2.54mm
FR Material Grade
FR2
Length
160mm
Thickness
1.6mm
Width
100mm
Country of Origin
United Kingdom
Product details
High Density DIP board, Single Sided
Ideal for high density circuitry using wirewrapping, hardwiring or Verowire interconnection rechniques.
Prototyping DIP board, high density
3U Eurocard format PCB from copper clad SRBP material UL94 V0 rated
Two Vcc and one 0V power rail options
DIN 41494 cardframe compatible
DIN 41612 connector pattern, up to 64/96 ways
Microbus backplane compatible
DIN Type Stripboards
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SR 220.35
Each (ex VAT)
SR 253.40
Each (inc. VAT)
1
SR 220.35
Each (ex VAT)
SR 253.40
Each (inc. VAT)
1
Technical Document
Specifications
Brand
Vero TechnologiesBase Material
Synthetic Resin Bonded Paper
Number of Sides
1
Dimensions
100 x 160 x 1.6mm
Hole Diameter
1.02mm
Hole Layout
53 x 5
Hole Pitch
2.54 x 2.54mm
FR Material Grade
FR2
Length
160mm
Thickness
1.6mm
Width
100mm
Country of Origin
United Kingdom
Product details
High Density DIP board, Single Sided
Ideal for high density circuitry using wirewrapping, hardwiring or Verowire interconnection rechniques.
Prototyping DIP board, high density
3U Eurocard format PCB from copper clad SRBP material UL94 V0 rated
Two Vcc and one 0V power rail options
DIN 41494 cardframe compatible
DIN 41612 connector pattern, up to 64/96 ways
Microbus backplane compatible